Interface Buttons: pin fins, extrusions, skived fin, high aspect, board level
 

Bonded Fin

Thermo Cool’s Bonded Fin heat sink. This High Aspect ratio Bonded Fin Heat Sink is manufactured using a special complex scientific process that allows us to produce a bonded fin heat sink that can acheive ratios of up to 50/1.
 

Features & Benefits

  • A larger surface area
  • Improved base to fin convection
  • Choice of Aluminum or Copper

Applications

  • Power Conversion
  • Aspect Ratios up to 50/1
  • Industrial Electronics
  • All other High Power applications
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